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12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

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12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

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Brand Name : zmkj

Model Number : 4.125/6.125/6inch/8inch

Certification : Cz/ Rohs/ GSG

Place of Origin : China

MOQ : 1pcs

Price : by case

Payment Terms : Western Union, T/T, L/C

Supply Ability : 100pcs

Delivery Time : 3-4weeks

Packaging Details : by substrates cassette box

material : SiO2

Customized : yes

thickness : customized

TTV : < 10 um

Surface Finish : S/D 40/20

Chemical Properties : Durability

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12inch dia300mm Borosilicate33 bf33 Glass Wafers Glass Substrate with high refractive index

8inch 1.0thickness dia100mm 0001 sapphire wafer 1sp or 2s

Product description

BF33 (Borofloat 33) by ZMSH is a type of heavy flint glass that is commonly used as a substrate material in various optical applications. It is known for its high refractive index and low dispersion, which makes it useful for applications that require high light focusing and power density. BF33 is made from a borosilicate glass, which has a low coefficient of thermal expansion and high resistance to thermal shock. This makes it an ideal substrate for high-temperature processing and for use in harsh environments. BF33 is commonly used in applications such as laser mirrors, beam splitters, and optical lenses, among others. The exact properties and characteristics of BF33 will depend on the manufacturer and the specific production process used to make it. Alternatives to BF33 (Borofloat 33) glass substrate include: BK7 glass substrate Fused Silica Sapphire Zerodur Corning Willow Glass Alumina

Specification

Spec 4" 6" 8" 12”
Diameter 100mm 150mm 200mm 300mm
Thickness

0.10mm

up

0.30mm

up

0.40mm

up

0.50mm up
Primary Flat 32.5mm

47.5mm

/ 57.5mm

/ Notch

Notch Notch
LTV (5mmx5mm) < 0.5um < 0.5um < 0.5um < 0.5um
TTV < 2um < 3um <3um <10um
Bow ±20um ±30um ±40um ±40um
Warp ≤ 30um ≤ 40um ≤ 70um ≤ 80um
Edge Rounding Compliant with SEMI M1.2 Standard/refer to IEC62276
Surface Type Single Side Polished / Double Sides Polished
Polished side Ra Ra≤1nm
Back Side Criteria Ra 0.2-0.7um or Customized

WAFER FABRICATION PROCESS
Shape Cut
Thin sheets are scribed, thick sheets are water jetted and blocks are wire sawn to begin the process with a wafer "blank".


CNC Edge
Each wafer is individually edged on a Precision CNC Edge Grinding Station.


Lapping
As required, wafers are lapped to precise thickness or flatness.


Polishing
Double-side Commercial Polish removes subsurface damage and Super Polish creates a pristine finish.


Cleaning
We combine ultrasonics and megasonics on multiple cleaning lines which feed directly into a Class 100 Clean Room.


Inspection
In our Class 100 Optical Clean Room, we inspect to various quality levels under the appropriate lighting conditions.


Packaging
All wafers are packed in pre-cleaned containers, double bagged and vacuum sealed within the Class 100 Clean Room.

Product display

12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

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12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use

FAQ:

Q: What's your MOQ?

A: (1) For inventory, the MOQ is 10pcs.

(2) For customized products, the MOQ is 25pcs up.

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, EMS etc.

(2) If you have your own express account, it's great.If not,we could help you ship them.

Freight is in accordance with the actual settlement.

Q: What's the delivery time?

For inventory: the delivery is 5 workdays after you place the order.

For customized products: the delivery is 2 or 3 weeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.as like 4inch 0.65mm,0.5mm polished wafer.

Q: How to pay?

A:50%deposit, left before delivery T/T,

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical

components based on your needs.


Product Tags:

Borosilicate 33 Substrate Glass

      

12inch Glass Wafers

      

Al2O3 Monocrystalline Glass Wafers

      
China 12inch dia 300mm C plane BF33 glass wafer 2sp For Anodic Bonding use wholesale

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